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Sensors and Measurement Systems, 2nd Edition


Year: 2021
Language: english
Author: Walter Lang
Genre: Guide
Publisher: River Publisher
Edition: 2nd Edition
ISBN: 9788770226066
Format: PDF
Quality: eBook
Pages count: 246
Description: Sensors and measurement systems is an introduction to microsensors for engineering students in the final undergraduate or early graduate level, technicians who wants to know more about the systems they are using, and anybody curious enough to know what microsystems and microsensors can do. The book discusses five families of sensors: - Thermal sensors - Force and pressure sensors- Inertial sensors - Magnetic field sensors- Flow sensorsFor each sensor, theoretical, technology and application aspects are examined. The sensor function is modelled to understand sensitivity, resolution and noise. We ask ourselves: What do we want to measure? What are possible applications? How are the sensor chips made in the cleanroom? How are they mounted and integrated in a system?After reading this book, you should be able to:- Understand important thermal, mechanical, inertial and magnetic sensors- Work with characterization parameters for sensors- Choose sensors for a given application and apply them- Understand micromachining technologies for sensors

Contents

Acknowledgment ix
List of Figures xi
List of Tables xix
List of Abbreviations xxi
Introduction: The Idea of This Book 1
1 Thermal Sensors 7
1.1 Measuring the Temperature . . . . . . . . . . . . . . . . . 7
1.1.1 Thermoelectric Effect (Seebeck Effect) . . . . . . . 8
1.1.2 Thermoresistive Effect . . . . . . . . . . . . . . . . 13
1.1.3 Pyroelectric Effect . . . . . . . . . . . . . . . . . . 15
1.2 Radiation Thermometer . . . . . . . . . . . . . . . . . . . 16
1.2.1 Static Modeling of Thermal Transport
and Understanding Sensitivity . . . . . . . . . . . . 20
1.2.2 Modeling Dynamic Behavior . . . . . . . . . . . . 24
1.2.3 The Noise of the Thermopile . . . . . . . . . . . . 28
1.2.4 Sensor Electronics: Building the System . . . . . . 32
1.2.5 The Alternatives: Pyroelectric Sensor
and Bolometer . . . . . . . . . . . . . . . . . . . . 33
1.3 A Topical Application Example: Infrared Gas Sensing of
Ethylene . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
1.4 Important Terms and Definitions for Sensor
Characterization . . . . . . . . . . . . . . . . . . . . . . . 38
1.5 Excursus to Wireless Sensor Networks . . . . . . . . . . . 41
Questions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
vvi Contents
2 Sensor Technology 47
2.1 Basics of Microtechnology . . . . . . . . . . . . . . . . . . 47
2.2 Thin Films . . . . . . . . . . . . . . . . . . . . . . . . . . 49
2.2.1 Silicon as a Substrate . . . . . . . . . . . . . . . . 49
2.2.2 Thin Films . . . . . . . . . . . . . . . . . . . . . . 49
2.2.3 Thin-Film Deposition Methods: An Overview . . . 53
2.2.4 Physical Vapor Deposition (PVD) . . . . . . . . . . 53
2.2.5 Chemical Vapor Deposition (CVD) . . . . . . . . . 59
2.2.6 Oxidation of Silicon . . . . . . . . . . . . . . . . . 62
2.2.7 Surface Migration and Step Coverage . . . . . . . . 63
2.3 Thin-Film Deposition Control . . . . . . . . . . . . . . . . 64
2.3.1 Metal Films: Measuring Sheet Resistance . . . . . . 65
2.3.2 Dielectric Films: Interferometers . . . . . . . . . . 66
2.3.3 Doping . . . . . . . . . . . . . . . . . . . . . . . . 68
2.4 Wafer Bonding . . . . . . . . . . . . . . . . . . . . . . . . 68
2.4.1 Silicon Fusion Bonding . . . . . . . . . . . . . . . 68
2.4.2 Anodic Bonding . . . . . . . . . . . . . . . . . . . 69
2.5 Making Structures . . . . . . . . . . . . . . . . . . . . . . 70
2.5.1 Lithography . . . . . . . . . . . . . . . . . . . . . 70
2.5.2 Etching Fundamentals . . . . . . . . . . . . . . . . 74
2.5.3 Anisotropic Wet Etching of Silicon . . . . . . . . . 76
2.5.4 Dry Etching . . . . . . . . . . . . . . . . . . . . . 79
2.6 The Thermopile Process . . . . . . . . . . . . . . . . . . . 83
2.7 The Recent Trend: Flexible Structures
and Polymer MEMS . . . . . . . . . . . . . . . . . . . . . 90
Questions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
3 Force and Pressure Sensors 95
3.1 The Piezoresistive Effect . . . . . . . . . . . . . . . . . . . 95
3.2 Strain Gauges and Force Sensing . . . . . . . . . . . . . . 98
3.3 Pressure Sensors: Dimensions, Ranges and Applications . . 99
3.4 Piezoresistive Pressure Sensors . . . . . . . . . . . . . . . 102
3.4.1 Steel Membrane Sensors . . . . . . . . . . . . . . . 102
3.4.2 Silicon Membrane Sensors . . . . . . . . . . . . . 105
3.5 From the Wafer to the System – Technology of the Silicon
Pressure Sensor . . . . . . . . . . . . . . . . . . . . . . . . 106
3.5.1 Silicon Technology . . . . . . . . . . . . . . . . . 106
3.5.2 Electric Test Structures . . . . . . . . . . . . . . . 109
3.5.3 Mounting and Housing Technology . . . . . . . . . 113Contents vii
3.5.4 Integrating MEMS and Electronics . . . . . . . . . 115
3.5.5 Example of a Commercial Pressure Sensor . . . . . 118
3.5.6 Sensor Electronics . . . . . . . . . . . . . . . . . . 121
3.5.7 Calibration . . . . . . . . . . . . . . . . . . . . . . 126
3.5.8 System Test, Reliability and Failure Modes . . . . . 127
3.6 Capacitive Pressure Sensors . . . . . . . . . . . . . . . . . 129
3.7 The Recent Trend: Additive Technology and Printed
Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
Questions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
4 Inertial Sensors 143
4.1 Inertial Measurement of Motion . . . . . . . . . . . . . . . 143
4.2 Acceleration Sensors . . . . . . . . . . . . . . . . . . . . . 144
4.2.1 Applications and Ranges . . . . . . . . . . . . . . 144
4.2.2 Sensor Principles and Resonance . . . . . . . . . . 147
4.2.3 Layout and Technology . . . . . . . . . . . . . . . 150
4.2.4 Accelerometer Electronics . . . . . . . . . . . . . . 153
4.2.5 Resolution and Noise . . . . . . . . . . . . . . . . 155
4.3 Angular Rate Sensors . . . . . . . . . . . . . . . . . . . . . 157
4.3.1 Applications and Ranges . . . . . . . . . . . . . . 158
4.3.2 Sensor Idea and Coriolis Force . . . . . . . . . . . 160
4.3.3 Layout . . . . . . . . . . . . . . . . . . . . . . . . 161
4.3.4 Technology . . . . . . . . . . . . . . . . . . . . . 168
4.3.5 Movement and Noise . . . . . . . . . . . . . . . . 171
4.3.6 Inertial Measurement Units (IMU) and Sensor
Fusion . . . . . . . . . . . . . . . . . . . . . . . . 173
Questions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
5 Magnetic Sensors 177
5.1 Dimensions, Ranges and Applications . . . . . . . . . . . . 177
5.2 The Hall Sensor . . . . . . . . . . . . . . . . . . . . . . . . 178
5.3 The Resistive Hall Probe . . . . . . . . . . . . . . . . . . . 181
5.4 The Giant Magnetoresistive Effect . . . . . . . . . . . . . . 182
5.5 The Tunneling Magnetoresistive Sensor . . . . . . . . . . . 184
5.6 The Fluxgate Sensor . . . . . . . . . . . . . . . . . . . . . 187
Questions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
6 Flow Sensors 193
6.1 Ranges and Applications . . . . . . . . . . . . . . . . . . . 193viii Contents
6.2 Types of Flow Sensors . . . . . . . . . . . . . . . . . . . . 195
6.3 Pressure Sensors for Flow Measurement . . . . . . . . . . . 195
6.4 Coriolis Flow Sensor . . . . . . . . . . . . . . . . . . . . . 198
6.5 Electromagnetic Flow Sensor . . . . . . . . . . . . . . . . 201
6.6 Thermal Flow Sensor . . . . . . . . . . . . . . . . . . . . . 202
6.6.1 Hot Wire Probe . . . . . . . . . . . . . . . . . . . 202
6.6.2 The Mass Flow Controller . . . . . . . . . . . . . . 203
6.6.3 Thermal Membrane Flow Sensors . . . . . . . . . . 204
6.6.4 Modeling of the Thermal Anemometer . . . . . . . 208
Questions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
Index 215
About the Author 221

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